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| PHT Vishay Sfernice High Precision Wraparound - High Temperature (230 C) Thin Film Chip Resistors FEATURES * Operating temperature range: - 55 C; + 215 C * Storage temperature: - 55 C; + 230 C * Gold terminations (< 1 m thick) * 4 sizes available (0603, 0805, 1206, 2010) other sizes upon request INTRODUCTION For applications such as down hole applications, the need for parts able to withstand very severe conditions (temperature as high as 215 C powered or up to 230 C un-powered) has leaded Vishay Sfernice to push out the limit of the thin film technology. Designers might read the application note: Power Dissipation Considerations in High Precision Vishay Sfernice Thin Film Chip Resistors and Arrays (P, PRA etc...) (High Temperature Application) www.vishay.com/doc?53047 in conjunction with this datasheet to help them to properly design their PCBs and get the best performances of the PHT. Vishay Sfernice R&D engineers will be willing to support any customer design considerations. * Temperature coefficient down to 25 ppm (- 55 C; + 215 C) * Tolerance down to 0.05 % * Load life stability: 0.5 % max after 1000 h at 215 C (ambient) at Pn * SMD wraparound * Compliant to RoHS directive 2002/95/EC DIMENSIONS in millimeters (inches) A D D C B E E A CASE SIZE MAX. TOL. + 0.152 (+ 0.006) MIN. TOL. - 0.152 (- 0.006) NOMINAL 0603 0805 1206 2010 1.52 (0.060) 1.91 (0.075) 3.06 (0.120) 5.08 (0.200) B MAX. TOL. + 0.127 (+ 0.005) MIN. TOL. - 0.127 (- 0.005) NOMINAL 0.85 (0.033) 0.38 (0.015) 1.27 (0.050) 1.60 (0.063) 2.54 (0.100) 0.5 (0.02) 0.127 (0.005) 0.13 (0.005) 0.40 (0.016) 0.48 (0.019) D/E C NOMINAL TOLERANCE ** Please see document "Vishay Material Category Policy": www.vishay.com/doc?99902 www.vishay.com 1 For technical questions, contact: sfer@vishay.com Document Number: 53050 Revision: 10-Aug-10 PHT High Precision Wraparound - High Temperature (230 C) Thin Film Chip Resistors SUGGESTED LAND PATTERN (to IPC-7351A) Vishay Sfernice Gmin. Xmax. Zmax. DIMENSIONS (in millimeter) CHIP SIZE Zmax. 0603 0805 1206 2010 2.37 2.76 3.91 5.93 Gmin. 0.35 0.74 1.85 3.71 Xmax. 0.98 1.40 1.73 2.67 STANDARD ELECTRICAL SPECIFICATIONS TEST Series Ohmic Range (1) (2) SPECIFICATIONS 0603, 0805, 1206, 2010 10R to 7M6 (depending on series) 25 ppm/C, 50 ppm/C, 100 ppm/C 0.05 %, 0.1 %, 0.5 %, 1 % 12.5 mW to 100 mW - 55 C; + 215 C 75 V to 300 V 0.50 % - 55 C; + 230 C 0.7 % typ. (1 % max.) CONDITIONS Temperature Coefficient Tolerance Power Rating (Pn) (3) - 55 C; + 215 C 215 C Operating Temperature Range Limiting Voltage (3) Load Life Stability Storage Temperature Range Shelf Life Stability Notes (1) Please refer to table 3 for TCR versus ohmic values (2) See table 2 (3) See table 1 1000 h/215 C (ambient) at Pn 8000 h/230 C Caution: Performances obtained with following mounting conditions: PCB: Polyimide Solder paste: PbSnAg (93.5/5/1.5) Document Number: 53050 Revision: 10-Aug-10 For technical questions, contact: sfer@vishay.com www.vishay.com 2 PHT Vishay Sfernice High Precision Wraparound - High Temperature (230 C) Thin Film Chip Resistors TABLE 1 SIZE 0603 0805 1206 2010 POWER RATING (1) 12.5 mW 20 mW 33 mW 100 mW LIMITING VOLTAGE 75 V 150 V 200 V 300 V Note (1) For power handling improvement, please refer to application note 53047: Power Dissipation Considerations in High Precision Vishay Sfernice Thin Film Chip Resistors and Arrays (High Temperature Applications) www.vishay.com/doc?/53047 and consult Vishay Sfernice TABLE 2 - TEMPERATURE COEFFICIENT Y E H 10 ppm/C 25 ppm/C 25 ppm/C 50 ppm/C 50 ppm/C 100 ppm/C - 55 C; + 155 C - 55 C; + 215 C - 55 C; + 155 C - 55 C; + 215 C - 55 C; + 155 C - 55 C; + 215 C TABLE 3 OHMIC RANGE (2) SERIES Min. 0603 0805 1206 2010 Note (2) Best tolerance possible: 0.5 %: 10 to < 20 0.1 %: 20 to < 39 0.05 %: 39 to max. value 39 39 39 39 CT: Y Max. 320K 511K 1M8 5M Min. 10 10 10 10 CT: E/H Max. 320K 725K 2M7 7M6 PHT STABILITY CURVE High Temperature Drift vs. Time 0.7 0.6 0.5 Drift in % 0.4 0.3 0.2 T = 185 C 0.1 0.0 T = 230 C With Pd (Tj = 230 C) T = 215 C T = 200 C 0 1000 2000 3000 4000 Time in h 5000 6000 7000 8000 Note * Stability will be dependent on resistivity of resistor. Above curves are worst case. www.vishay.com 3 For technical questions, contact: sfer@vishay.com Document Number: 53050 Revision: 10-Aug-10 PHT High Precision Wraparound - High Temperature (230 C) Thin Film Chip Resistors MECHANICAL SPECIFICATIONS Substrate Resistive Element Passivation Protection Terminations Note * For other terminations, please consult Alumina Nichrome (NiCr) Silicon nitride (Si3N4) Epoxy + Silicone Gold (< 1 m) over nickel barrier Vishay Sfernice POPULAR OPTIONS It is recommended to consult Vishay Sfernice for availability first. Option: Enlarged terminations: For stringent and special power dissipation requirements, the thermal resistance between the resistive layer and the solder joint can be reduced using enlarged terminations chip resistors which are soldered on large and thick copper pads acting as heatsink (see application note: 53048 Power Dissipation in High Precision Vishay Sfernice Chip Resistors and Arrays (P Thin Film, PRA Arrays, CHP Thick Film) www.vishay.com/doc?53048. Option to order: 0063 (applies to size 1206/2010). DIMENSIONS (Option 0063) in millimeters Bottom view for mounting A Uncoated ceramic Enlarged termination B F D E A CASE SIZE MAX. TOL. + 0.152 MIN. TOL. - 0.152 NOMINAL 1206 2010 3.06 5.08 B MAX. TOL. + 0.127 MIN. TOL. - 0.127 NOMINAL 1.60 2.54 E MAX. TOL. + 0.13 MIN. TOL. - 0.13 NOMINAL 0.40 0.48 D MAX. TOL. + 0.13 MIN. TOL. - 0.13 NOMINAL 1.215 2.25 NOMINAL 0.63 F MIN. 0.50 MAX. 0.76 SUGGESTED LAND PATTERN (Option 0063) Gmin. Xmax. Zmax. CHIP SIZE 1206 2010 DIMENSIONS (in millimeter) Zmax. 3.91 5.93 Gmin. 0.50 Xmax. 1.73 2.67 Document Number: 53050 Revision: 10-Aug-10 For technical questions, contact: sfer@vishay.com www.vishay.com 4 PHT Vishay Sfernice High Precision Wraparound - High Temperature (230 C) Thin Film Chip Resistors PACKAGING ESD packaging available: waffle-pack, and plastic tape and reel (low conductivity). Paper tape available upon request (ESD only). NUMBER OF PIECES PER PACKAGE SIZE MOQ WAFFLE PACK 2" x 2" TAPE AND REEL MIN. MAX. TAPE WIDTH PACKAGING RULES Waffle Pack Can be filled up to maximum quantity indicated in the table here above, taking into account the minimum order quantity. When quantity ordered exceeds maximum quantity of a single waffle pack, the waffle packs are stacked up on the top of each other and closed by one single cover. To get "not stacked up" waffle pack in case of ordered quantity > maximum number of pieces per package: Please consult Vishay Sfernice for specific ordering code Tape and Reel Can be filled up to maximum quantity indicated in the table here above, taking into account the minimum order quantity. When quantity ordered is between the MOQ and the maximum reel capacity, only one reel is provided. When several reels are needed for ordered quantity within MOQ and maximum reel capacity: Please consult Vishay Sfernice for specific ordering code 0603 100 0805 100 1206 2010 Note (1) 12 mm on request 140 60 2000 8 mm (1) 100 4000 8 mm GLOBAL PART NUMBER INFORMATION Global Part Numbering: PHT1206Y1001BGT063 P H T 1 2 0 6 Y 1 0 0 1 B G T 0 6 3 GLOBAL MODEL PHT SIZE 0603 0805 1206 2010 TCR Y E H VALUE The first three digits are significant figures and the last digit specifies the number of zeros to follow, R designates decimal point 10R0 = 10 3901 = 3900 1004 = 1 M TOLERANCE W = 0.05 % B = 0.1 % D = 0.5 % F=1% TERMINATION G = Gold N = Tin/silver (2) PACKAGING T = Tape and reel Blank = Waffle pack OPTION Leave blank if no option Note (2) For usage at temperatures up to 200 C maximum N (tin/silver termination are available upon request) www.vishay.com 5 For technical questions, contact: sfer@vishay.com Document Number: 53050 Revision: 10-Aug-10 Legal Disclaimer Notice Vishay Disclaimer All product specifications and data are subject to change without notice. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, "Vishay"), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product. Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay's terms and conditions of purchase, including but not limited to the warranty expressed therein, which apply to these products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. Product names and markings noted herein may be trademarks of their respective owners. Document Number: 91000 Revision: 18-Jul-08 www.vishay.com 1 |
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